International standardization activities for embedded device substrate

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作者：
JETPA, 1241-12 Okazu-cho, Izumi-ku, Yokohama-shi, Kanagawa 245-0003, Japan [1 ]
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来源：
J. Jpn. Inst. Electron. Packag. | 2012年 / 7卷 / 508-514期
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D O I：
10.5104/jiep.15.508
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2
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