Fuzzy reliability analysis of vibration in CSP package

被引：0
|
作者：
Liu, Xiao-Bao [1 ]
Du, Ping-An [1 ]
Li, Lei [1 ]
机构：
[1] School of Mechatronics Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China
来源：
Dianzi Keji Daxue Xuebao/Journal of the University of Electronic Science and Technology of China | 2008年 / 37卷 / 03期
关键词：
Chip size package - CSP packages - Fuzzy reliability - Fuzzy reliability analysis - Fuzzy theory - Resonant regions - Vibration analysis models - Vibration reliability;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：478 / 480
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