Fabrication technology of III-V semiconductor photonic devices on soi substrate using direct bonding method

被引：0
|
作者：
Nishiyama N. [1 ]
机构：
[1] Department of Electrical and Electronic Engineering, Tokyo Institute of Technology, School of Engineering, 2-12-1-S9-1, O-okayama, Meguro-ku, Tokyo
来源：
Journal of Japan Institute of Electronics Packaging | 2017年 / 20卷 / 06期
关键词：
All Open Access; Bronze;
D O I：
10.5104/jiep.20.396
中图分类号：
学科分类号：
摘要：
[No abstract available]
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页码：396 / 400
页数：4
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