Effect of Nd on the high temperature reliability of Sn-3.8Ag-0.7Cu/Cu solder joint

被引：0
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作者：
Wu, Jie [1 ]
Xue, Songbai [2 ]
Yu, Zhihao [1 ]
Tan, Cheeleong [1 ]
Sun, Huabin [1 ]
Xu, Yong [1 ]
机构：
[1] Nanjing University of Posts and Telecommunications, Nanjing,210003, China
[2] Nanjing University of Aeronautics and Astronautics, Nanjing,210016, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2021年 / 42卷 / 07期
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页码：9 / 13
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