Voltammetric characterization for the growth of oxide films formed on copper in air

被引：0
|
作者：
Nakayama, Shigeyoshi [1 ]
Shibata, Masahiro [1 ]
Kuwabata, Susumu [2 ]
Osakai, Toshiyuki [3 ]
Notoya, Takenori [4 ]
机构：
[1] Analysis Technology Research Center, Sumitomo Electric Industries, Ltd., 1-1-3, Shimaya, Konohana-ku, Osaka 554-0024, Japan
[2] Department of Materials Chemistry, Graduate School of Engineering, Osaka University, 2-1, Yamada-oka, Suita 565-0871, Japan
[3] Department of Chemistry, Faculty of Science, Kobe University, 1-2-1, Tsurukabuto, Nada-ku, Kobe 657-8501, Japan
[4] Molecular Science Division, Graduate School of Engineering, Hokkaido University, 13-8, Kita, Kita-ku, Sapporo 060-8628, Japan
来源：
Zairyo to Kankyo/ Corrosion Engineering | 2002年 / 51卷 / 12期
关键词：
Copper compounds - Corrosion - Cyclic voltammetry - Electrolytes - Oxidation - Reaction kinetics;
D O I：
10.3323/jcorr1991.51.566
中图分类号：
学科分类号：
摘要：
The growth mechanisms of oxide films thermally formed on copper have been studied using double sweep cyclic voltammetry in strongly alkaline electrolytes. It was found that an electrolyte of 6M KOH + 1M LiOH allowed perfect resolution of cathodic waves due to the reduction of Cu2O and CuO. The effect of the types of anion on copper oxidation mechanism was investigated in many factors of corrosion. C opper sheets were prepared by pre immersion in various electrolytes of sodium salt, followed by heating in air at 80°C and 90% RH. The formation kinetics of each oxide films followed the parabolic rate law with a few exceptions. These were confirmed that the formation of the oxide films was accelerated with the increase of ions on copper and that the oxidation rate of Cu2O or CuO was controlled by the types of anion.
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页码：566 / 570
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