Hot plates

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| 2001年 / Angel Buiness Communications Ltd.卷 / 23期
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Heat convection - Heat radiation - Low temperature production - Pyrometry - Silicon wafers;
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摘要：
A five wafer batch annealing system using resistively heated, stacked hot plates was designed and tested for low temperature annealing applications for 200mm and 300mm wafers. The stacked hot plate configuration makes convection between hot plates negligible and provides an isothermal environment for the wafer. This annealing system was found to be promising for low temperature annealing processes such as Cu anneal, Al anneal, low k dielectrics anneal and photoresist baking applications.
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