Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

被引：0
|
作者：
Xu, Hailong [1 ]
Yin, Zhen [1 ,2 ]
Miao, Qing [1 ,2 ]
Dai, Chenwei [1 ,2 ]
Cheng, Jingcai [1 ]
Li, Hua [1 ,2 ]
Liang, Zhiqiang [3 ]
Li, Zhanjie [4 ]
机构：
[1] School of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou,215009, China
[2] Suzhou Key Laboratory of Precision and Efficient Machining Technology, Suzhou University of Science and Technology, Suzhou,215009, China
[3] School of Mechanical Engineering, Beijing Institute of Technology, Beijing,100081, China
[4] Tianjin Key Laboratory of High Speed Cutting and Precision Machining, Tianjin University of Technology and Education, Tianjin,300222, China
来源：
Materials Science in Semiconductor Processing | 2024年 / 171卷
基金：
中国国家自然科学基金;
关键词：
Sapphire;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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