Computers and Electrical Engineering: Guest editorial
被引:0
|
作者:
Wysocki, Beata J.
论文数: 0引用数: 0
h-index: 0
机构:
Department of Computer and Electronics Engineering, University of Nebraska, Lincoln, United StatesDepartment of Computer and Electronics Engineering, University of Nebraska, Lincoln, United States
Wysocki, Beata J.
[1
]
Wysocki, Tadeusz A.
论文数: 0引用数: 0
h-index: 0
机构:
Department of Computer and Electronics Engineering, University of Nebraska, Lincoln, United StatesDepartment of Computer and Electronics Engineering, University of Nebraska, Lincoln, United States
Wysocki, Tadeusz A.
[1
]
Sharif, Hamid
论文数: 0引用数: 0
h-index: 0
机构:
Department of Computer and Electronics Engineering, University of Nebraska, Lincoln, United StatesDepartment of Computer and Electronics Engineering, University of Nebraska, Lincoln, United States
Sharif, Hamid
[1
]
机构:
[1] Department of Computer and Electronics Engineering, University of Nebraska, Lincoln, United States
机构:
IIFC Working Group on Bond Behaviour of FRP in Structures, University of Edinburgh, United KingdomIIFC Working Group on Bond Behaviour of FRP in Structures, University of Edinburgh, United Kingdom
Chen, Jian-Fei
Teng, Jin-Guang
论文数: 0引用数: 0
h-index: 0
机构:
IIFC Working Group on Bond Behaviour of FRP in Structures, Hong Kong Polytechnic University, Hong KongIIFC Working Group on Bond Behaviour of FRP in Structures, University of Edinburgh, United Kingdom
Teng, Jin-Guang
Smith, Scott T.
论文数: 0引用数: 0
h-index: 0
机构:
APFIS 2007, University of Hong Kong, Hong KongIIFC Working Group on Bond Behaviour of FRP in Structures, University of Edinburgh, United Kingdom
机构:Department of Materials Science, Institute of Materials Science and Technology (IMT), Friedrich-Schiller-Universily Jena, Löbdergraben 32, D-07743 Jena, Germany
Jandt, Klaus D.
Kaiyong, Cai
论文数: 0引用数: 0
h-index: 0
机构:Department of Materials Science, Institute of Materials Science and Technology (IMT), Friedrich-Schiller-Universily Jena, Löbdergraben 32, D-07743 Jena, Germany