3D quality information extraction technology for SMT solder joint of chip components

被引：0
|
作者：
Zhao, Hui-Huang [1 ]
Zhou, De-Jian [2 ,3 ]
Huang, Chun-Yue [3 ]
机构：
[1] School of Electronical and Mechanical Engineering, Xidian University, Xi'an 710071, China
[2] Department of Mechanical Engineering, Guangxi University of Technology, Liuzhou 545006, China
[3] School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
来源：
Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS | 2010年 / 16卷 / 08期
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页码：1714 / 1719
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