Device-level packaging for optical integration

被引：0
|
作者：
Lecarpentier, Gilbert [1 ]
Racz, Livia [1 ]
机构：
[1] AXSUN Technologies, 1 Fortune Dr., Billerica, MA 01821, United States
来源：
Advanced Packaging | 2003年 / 12卷 / 01期
关键词：
Costs - Fiber optic networks - Lithography - Optical systems - Optoelectronic devices;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
A report is presented on the device-level packaging for optical integration. Recently developed platforms make it feasible to align any combination of active and passive devices within a single component-sized footprint. Such approaches allow telecom system manufacturers to get high-performance and high-quality devices at a reasonable price.
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收藏
页码：17 / 19
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