Recess-gate AlGaN/GaN HFET

被引:0
|
作者
Zhang, Zhiguo [1 ,2 ,3 ]
Feng, Zhen [1 ,2 ]
Yang, Mengli [1 ,2 ]
Feng, Zhihong [1 ,2 ]
Mo, Jianghui [1 ,2 ]
Cai, Shujun [1 ,2 ]
Yang, Kewu [1 ,2 ]
机构
[1] The 13th Research Institute, China Electronics Technology Group Corporation, Shijiazhuang 050051, China
[2] National Key Laboratory of ASIC, Shijiazhuang 050051, China
[3] School of Microelectronics, Xidian University, Xi'an 710071, China
关键词
Aluminum gallium nitride - Electric potential - Heterojunctions;
D O I
暂无
中图分类号
学科分类号
摘要
A recessed gate AlGaN/GaN HFET with a total gate length of 100μm is studied. The device demonstrates an increase in transconductance from 260.3 to 314.8mS/mm compared to the unrecessed device, while the saturation current changes slightly. Moreover, the ideality is improved from 2.3 to 1.7. An output power density of 11.74W/mm is achieved at 8GHz and 40V using a load pull system.
引用
收藏
页码:1420 / 1423
相关论文
共 50 条
  • [1] Evaluation of AlGaN/GaN-HFET with HfAlO gate insulator
    Sazaw, H.
    Hirata, K.
    Kosaki, M.
    Shibata, N.
    Furuta, K.
    Yagi, S.
    Tanaka, Y.
    Kinoshita, A.
    Shimizu, M.
    Okumura, H.
    PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 4 NO 7 2007, 2007, 4 (07): : 2748 - +
  • [2] Normally-off AlGaN/GaN HFET with p-type GaN Gate and AlGaN Buffer
    Hilt, O.
    Knauer, A.
    Brunner, F.
    Bahat-Treidel, E.
    Wuerfl, J.
    2010 22ND INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2010, : 347 - 350
  • [3] Investigation on current collapse of AlGaN/GaN HFET by gate bias stress
    Ao, Jin-Ping
    Yamaoka, Yuya
    Okada, Masaya
    Hu, Cheng-Yu
    Ohno, Yasuo
    IEICE TRANSACTIONS ON ELECTRONICS, 2008, E91C (07) : 1004 - 1008
  • [4] Recess gate AlGaN/GaN HEMTs using overlap gate metal structure
    Ide, Toshihide
    Piao, Guanxi
    Yano, Yoshiki
    Shimizu, Mitsuaki
    PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 7, NO 7-8, 2010, 7 (7-8):
  • [5] AlGaN/GaN HFET Reliability
    Trew, Robert J.
    Green, Daniel S.
    Shealy, Jeffrey B.
    IEEE MICROWAVE MAGAZINE, 2009, 10 (04) : 116 - 127
  • [6] Trapping in AlGaN/GaN HFET
    National Key Laboratory of Monolithic Integrated Circuits and Modules, Nanjing Electronic Devices Institute, Nanjing 210016, China
    Guti Dianzixue Yanjiu Yu Jinzhan, 2007, 4 (457-463):
  • [7] Enhancement mode AlGaN/GaN HFET with selectively grown pn junction gate
    Hu, X
    Simin, G
    Yang, J
    Khan, MA
    Gaska, R
    Shur, MS
    ELECTRONICS LETTERS, 2000, 36 (08) : 753 - 754
  • [8] Impact of native oxides beneath the gate contact of AlGaN/GaN HFET devices
    Mistele, D
    Katz, O
    Horn, A
    Bahir, G
    Salzman, J
    PHYSICA STATUS SOLIDI C - CONFERENCES AND CRITICAL REVIEWS, VOL 2, NO 7, 2005, 2 (07): : 2627 - 2630
  • [9] 凹栅AlGaN/GaN HFET
    张志国
    冯震
    杨梦丽
    冯志红
    默江辉
    蔡树军
    杨克武
    Journal of Semiconductors, 2007, (09) : 1420 - 1423
  • [10] Optimized design of AlGaN/GaN HFET
    National Key Laboratory of Monolithic Integrated Circuits and Modules, Nanjing Electronic Devices Institute, Nanjing 210016, China
    Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics, 2007, 27 (02): : 163 - 169