The Bonding Order's Impact on Cost During Mid-Bond Test of 3D Chip

被引：0
|
作者：
Fang F. [1 ]
Qin Z.-L. [1 ,3 ]
Wang W. [1 ,3 ]
Zhu X. [1 ,3 ]
Guo E.-H. [2 ]
Ren F.-J. [1 ,3 ]
机构：
[1] Hefei University of Technology, Hefei, 230009, Anhui
[2] China Electronics Technology Group Corporation No. 38 Research Institute, Hefei, 230009, Anhui
[3] Anhui Province Key Laboratory of Affective Computing and Advanced Intelligent Machine, Hefei, 230009, Anhui
来源：
| 1600年 / Chinese Institute of Electronics卷 / 45期
关键词：
Cost model; Discarding cost; Mid-bond test; Stacking order; Test times optimization;
D O I：
10.3969/j.issn.0372-2112.2017.09.030
中图分类号：
学科分类号：
摘要：
Nowadays, due to the lack of appropriate 3D SICs (3D Stacked Integrated Circuits) cost estimation methods under the impact of the multiple bonding, and the generally neglect of the discarding costs in test process production, the existing test methods can not be well applied in the actual production. Based on the feature of mid-bond test, this paper proposed a 3D SICs theoretical total cost model, by synergistically considering the bonding rate and discarding cost, further, a 3D SICs optimal bonding order algorithm is proposed. Finally, the paper also puts forward a method to optimize the mid-bonding test times. This method can achieve "multiple bondings but plus one test" by replacing the traditional "one bonding and plus one test" method. Experimental results show that the cost of the proposed model is closer to the actual production. Optimal bonding order and Optimized mid-bonding test times can be effective to guide the 3D chip manufacturing. © 2017, Chinese Institute of Electronics. All right reserved.
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页码：2263 / 2271
页数：8
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