Thermal performance analysis for packaging configuration design of multifinger GaInP collector-up HBTs as small high-power amplifiers

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作者：
Department of Electronic Engineering, Kunshan University, Tainan 71003, Taiwan [1 ]
不详 [2 ]
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来源：
J. Shanghai Jiaotong Univ. Sci. | 2008年 / SUPPL.卷 / 39-41期
关键词：
Electronics packaging;
D O I：
10.1007/s12204-008-0839-4
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页码：39 / 41
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