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- [21] Instant reflow oven changeover in a world of short production runs Allen, M.B., 2016, PennWell Corporation (31):
- [22] PCB assemblers' demands drive reflow oven profiling technology Electronic Packaging and Production, 1998, 38 (11):
- [23] Development of Low-Cost Reflow Oven for SMT Assembly 2017 INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND SMART DEVICES (ISESD), 2017, : 51 - +
- [24] Engineered productivity: reliability, maintainability, and flexibility in reflow oven design National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East), 3 : 1765 - 1772
- [25] Risk Assessment in Maintenance of a Rehm Reflow Oven V8 SHO2015: INTERNATIONAL SYMPOSIUM ON OCCUPATIONAL SAFETY AND HYGIENE, 2015, : 6 - 8
- [28] CFD aided reflow oven profiling for PCB preheating in a soldering process EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 535 - +
- [29] Chip to Wafer Hermetic Bonding with Flux-less Reflow Oven PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 38 - 42
- [30] Data Analysis on SMT Reflow Oven with SECS/GEM Communication Protocol IEEE 10TH SYMPOSIUM ON COMPUTER APPLICATIONS AND INDUSTRIAL ELECTRONICS (ISCAIE 2020), 2020, : 118 - 124