Quantitative derivation and evaluation of wire length distribution in three-dimensional integrated circuits using simulated quenching

被引：0
|
作者：
Deguchi, Jun [1 ]
Sugimura, Takeaki [1 ]
Nakatani, Yoshihiro [1 ]
Fukushima, Takafumi [1 ]
Koyanagi, Mitsumasa [1 ]
机构：
[1] Department of Bioengineering and Robotics, Tohoku University, 6-6-01 Aza Aoba, Aramaki, Aoba-ku, Sendai 980-8579, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 2006年 / 45卷 / 4 B期
关键词：
Three-dimensional (3D) integration is the most promising technology to improve IC performance by stacking some active device layers and connecting them using vertical interconnections. In this paper; in order to quantitatively evaluate the benefits of 3D IC; wire length distributions in 3D ICs are derived by adapting the simulated quenching algorithm for 3D placement and routing of specific benchmark circuits. By evaluating the wire length distribution; we can confirm that the total wire length is reduced by 26.0 and 41.3% with three and five active layers; respectively; Similarly; 38.1 and 52.0% reduction in the longest wire length with three and five active layers can be achieved. © 2006 The Japan Society of Applied Physics;
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摘要：
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页码：3260 / 3265
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