Challenges in attaining lead-free solders

被引:0
|
作者
Baskin, Philip [1 ]
机构
[1] Superior Flux and Mfg. Co., Cleveland, OH
来源
Welding Journal (Miami, Fla) | 2007年 / 86卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:58 / 61
相关论文
共 50 条
  • [41] Hardness testing of lead-free solders: a review
    Yahaya, Muhamad Zamri
    Mohamad, Ahmad Azmin
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 29 (04) : 203 - 224
  • [42] Lead-free solders for flipchip-technology
    Leonhard, W
    Gemmler, A
    Heck, W
    Jordan, M
    Gust, W
    MICRO MATERIALS, PROCEEDINGS, 2000, : 1213 - 1215
  • [43] Are polymer solders the answer to lead-free assembly?
    Gilleo, Ken, 1600, IHS Publ Group, Libertyville, IL, United States (09):
  • [44] The creep of lead-free solders at elevated temperatures
    W. J. Plumbridge
    C. R. Gagg
    S. Peters
    Journal of Electronic Materials, 2001, 30 : 1178 - 1183
  • [45] Resonant vibration behavior of lead-free solders
    Song, JM
    Lui, TS
    Chen, LH
    Tsai, DY
    JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (12) : 1501 - 1508
  • [46] Thermal Conductivity of Molten Lead-Free Solders
    J. Bilek
    J. K. Atkinson
    W. A. Wakeham
    International Journal of Thermophysics, 2006, 27 : 92 - 102
  • [47] Developments in lead-free solders and soldering technology
    Kang, SK
    JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2002, 54 (06): : 25 - 25
  • [48] Polymer solders: The cool lead-free alternative?
    Gilleo, K
    ADVANCED ELECTRONICS ASSEMBLY - A SYMPOSIUM ON LEAD FREE INTERCONNECT TECHNOLOGY, PROCEEDINGS OF THE TECHNICAL PROGRAM, 2000, : 54 - 60
  • [49] Reactions of lead-free solders with CuNi metallizations
    T. M. Korhonen
    P. Su
    S. J. Hong
    M. A. Korhonen
    C. -Y. Li
    Journal of Electronic Materials, 2000, 29 : 1194 - 1199
  • [50] Lead-Free Solders in IC Manufacture: A Review
    V. V. Zenin
    V. N. Belyaev
    Yu. E. Segal
    A. A. Kolbenkov
    Russian Microelectronics, 2003, 32 (4) : 247 - 256