Study on evaluation method of thermal fatigue life for BGA solder joints

被引：0
|
作者：
Kurashiki, Tetsusei [1 ]
Zako, Masaru [1 ]
Ishii, Atsushi [2 ]
Hanaki, Satoshi [3 ]
Sugitani, Munehiko [4 ]
机构：
[1] Dept. of Manufacturing Sci., Osaka Univ., Yamada-oka, Suita 565-0871, Japan
[2] Shima Electonics Co. Ltd., Tatsuoka-cho, Nirasaki 407-0033, Japan
[3] Dept. of Mechanical Eng., Himeji Inst. of Tech. Univ., Shosha, Himeji 671-2201, Japan
[4] Osaka Univ., Yamada-oka, Suita 565-0871, Japan
来源：
Zairyo/Journal of the Society of Materials Science, Japan | 2003年 / 52卷 / 05期
关键词：
Thermal fatigue life;
D O I：
10.2472/jsms.52.535
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：535 / 540
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