On-chip manipulation of magnetic beads for integrated immunosensor

被引：0
|
作者：
机构：
[1] [1,Ishikawa, Tomohiro
[2] Lee, Jaesung
[3] 1,Miyake, Ryo
来源：
Ishikawa, T. (ishikawa@mems.mech.tohoku.ac.jp) | 1600年 / Institute of Electrical Engineers of Japan卷 / 133期
关键词：
Complementary metal oxide semiconductor process - Immunoassay - Integrated immunosensors - Magnetic beads - Off-chip components - On chips - Test chips;
D O I：
10.1541/ieejsmas.133.10
中图分类号：
学科分类号：
摘要：
The purpose of this work is in-plain manipulation of dispersed magnetic beads on a chip. This makes an immunoassay chip completes all its procedures on itself and eliminates any off chip components. A test chip was drawn in 180 nm standard Complementary Metal Oxide Semiconductor (CMOS) process and tested. Beads those have a diameter of 2.8 μm were diluted and applied onto the chip. The chip successfully manipulated them with an affordable current down to 5 mA. © 2013 The Institute of Electrical Engineers of Japan.
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