Microstructure and properties of Sn-Zn-Ga-xPr lead-free solder

被引：0
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作者：
Li, Yang [1 ]
Xue, Songbai [1 ]
Yang, Jingqiu [2 ]
Ye, Huan [1 ]
Chen, Cheng [1 ]
Gu, Liyong [3 ]
Gu, Wenhua [3 ]
机构：
[1] College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
[2] Harbin Welding Institute, Harbin 150080, China
[3] Changshu Huayin Filler Metals Co. Ltd., Changshu 215513, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2012年 / 33卷 / 05期
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页码：33 / 36
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