ELECTRO-THERMAL SIMULATION AND RELIABILITY OF A BALL GRID ARRAY

被引：0
|
作者：
El Hami N. [1 ]
Koulou A. [2 ]
Zemzami M. [3 ]
El Hami A. [4 ]
机构：
[1] Science and Engineering Laboratory, ENSA, University Ibn Tofail, Kenitra
[2] EST, University Ibn Tofail, Kenitra
[3] ENSAM, Mohamed V University, Rabat
[4] Laboratory of Mechanics of Normandy, INSA, Rouen
来源：
Electronic Device Failure Analysis | 2024年 / 26卷 / 02期
关键词：
ball grid array packages; electro-thermal simulation; reliability; thermal stress; weld joint cracks;
D O I：
10.31399/asm.edfa.2024-2.p022
中图分类号：
学科分类号：
摘要：
The influence of electric current flow and electrically induced Joule heat on thermal stress for weld joint cracks at both interfaces is still not fully comprehended. This article investigates the effect of subjecting the ball grid array package to a cyclic current input. Current density, Joule effect, and temperature curves are examined. © ASM International®.
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页码：22 / 30
页数：8
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