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- [1] Silicon Wafer Modification by Laser Interference 2013 8TH ANNUAL IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (IEEE NEMS 2013), 2013, : 1236 - 1239
- [2] Effect of Pulse Repetition Rate on Silicon Wafer Modification by Four-beam Laser Interference 2013 INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO), 2013, : 104 - 107
- [3] Nano-Surface Modification of Silicon with Ultra-Short Pulse Laser Process TECHNOLOGY EVOLUTION FOR SILICON NANO-ELECTRONICS, 2011, 470 : 117 - +
- [6] Ultra short laser pulse modification of wave cruides FOURTH INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, 2003, 5063 : 478 - 481
- [7] Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2008, 2 (04): : 540 - 549
- [8] High speed drilling of thin silicon wafer by UV laser 20TH ICALEO 2001, VOLS 92 & 93, CONGRESS PROCEEDINGS, 2001, : 1612 - 1619
- [9] Analysis of Internal Crack Propagation in Silicon Due to Permeable Pulse Laser Irradiation-Study on Processing Mechanism of Stealth Dicing FUNDAMENTALS OF LASER-ASSISTED MICRO- AND NANOTECHNOLOGIES 2010, 2011, 7996
- [10] AFM and Ellipsometry studies of ultra thin Ti film deposited on a silicon wafer ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES XV, 2014, 773-774 : 616 - +