Plasma-assisted adhesion improvement of various materials used for power device packaging

被引：0
|
作者：
Tajima S. [1 ]
机构：
[1] Plasma Nanotechnology Research Center, Graduate School of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, 464-8603, Aichi
来源：
Journal of Japan Institute of Electronics Packaging | 2016年 / 19卷 / 02期
基金：
美国国家科学基金会;
关键词：
D O I：
10.5104/jiep.19.111
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：111 / 119
页数：8
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