Materials and methods for the 3D structure fabrication of low temperature cofired ceramics for medium scale devices

被引：0
|
作者：
Suhas, K. [1 ]
机构：
[1] BMS College of Engineering, Bangalore, India
来源：
C e Ca | 2009年 / 39卷 / 03期
关键词：
Device fabrications - Fabrication process - Low temperature co-fired ceramics - Materials and process - Multi chip packaging - Sacrificial material - Structural details - Structuration;
D O I：
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学科分类号：
摘要：
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页码：169 / 176
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