Clip bonding on high-power modules

The clip-bonding technology has been used widely for the manufacturing of high-power semiconductor modules and components, thus ensuring high reliability. Clip-bonding technology replaces the standard wire-bond connection between die and lead by a solid copper bridge, soldered by solder paste, which offers unique package resistance, better thermal resistance, and ultra-fast switching performance due to the small package. Remelting of alloys, used for die-attach applications should be avoided during the soldering steps in production. Micro-phase cleaning products provide significant technological benefits and project improved cleaning efficiency, when compared to the terpene-based or hydrocarbon cleaning agents. A well-rooted assignment of single, correlated process steps is required for manufacturing of high-power modules to ascertain reliability, which calls for the cooperation between solder paste manufacturer and the cleaning agents suppliers.