Prediction of mechanical properties of lead-free solders using indentation method

被引：5
|
作者：
Miyamoto, Akira [1 ]
Ogawa, Takeshi [1 ]
Ohsawa, Tadashi [1 ]
机构：
[1] Hitachi, Ltd., Chiyoda-ku, Tokyo, 101-8010, Japan
来源：
Zairyo/Journal of the Society of Materials Science, Japan | 2002年 / 51卷 / 04期
关键词：
D O I：
10.2472/jsms.51.445
中图分类号：
学科分类号：
摘要：
12
引用
收藏
页码：445 / 450
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