Effects of ultrasonic on microstructure and mechanical properties of electroforming copper layer

被引：0
|
作者：
Liao, Qiang [1 ]
Zhu, Li-Qun [1 ]
Liu, Hui-Cong [1 ]
Li, Wei-Ping [1 ]
机构：
[1] Key Laboratory of Aerospace Materials and Performance of Ministry of Education, School of Materials Science and Engineering, Beihang University, Beijing 100191, China
来源：
Cailiao Kexue yu Gongyi/Material Science and Technology | 2010年 / 18卷 / 02期
关键词：
Electrometallurgy - MEMS - Ultrasonic applications - X ray diffraction - Electrochemistry - Electrodeposition - Tensile strength - Crystal microstructure - Scanning electron microscopy;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：206 / 210
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