Nano-structure control of leadframe surface to achieve robust juncture with epoxy resin

被引：0

作者：

Furuno, Ryota ^{[1
,2
]}

Yamasaki, Ryota ^{[2
]}

Kubo, Kimihiko ^{[1
]}

Haruyama, Tetsuya ^{[2
]}

机构：

[1] Mitsui High-tec, Inc., 2-10-1, Komine, Yahatanishi-ku, Kitakyushu, Fukuoka,807-8588, Japan

[2] Department of Life Science and Systems Engineering, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology, 2-4, Hibikino, Wakamatsu-ku, Kitakyushu, Fukuoka,808-0196, Japan

来源：

IEEJ Transactions on Sensors and Micromachines | 2015年 / 135卷 / 04期

关键词：

Nanostructures - Electroplating - Semiconductor junctions;

D O I：

10.1541/ieejsmas.135.129

中图分类号：

学科分类号：

摘要：

Delamination damages in a juncture between different materials will raise problems in electric products, such as semiconductor plastic package. In this study, we are proposing a tactic to achieve robust juncture between leadframe and epoxy resin based on nano-structure control of leadframe surface. In the result, nano-structure of plated layer on leadframe can be controlled by a strict condition of electroplating bath. The nano-structure controlled leadframe surface shown remarkable robust junction to the epoxy resin successfully. © 2015 The Institute of Electrical Engineers of Japan.

引用

页码：129 / 134

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