Nano-structure control of leadframe surface to achieve robust juncture with epoxy resin

被引：0
|
作者：
Furuno, Ryota [1 ,2 ]
Yamasaki, Ryota [2 ]
Kubo, Kimihiko [1 ]
Haruyama, Tetsuya [2 ]
机构：
[1] Mitsui High-tec, Inc., 2-10-1, Komine, Yahatanishi-ku, Kitakyushu, Fukuoka,807-8588, Japan
[2] Department of Life Science and Systems Engineering, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology, 2-4, Hibikino, Wakamatsu-ku, Kitakyushu, Fukuoka,808-0196, Japan
来源：
IEEJ Transactions on Sensors and Micromachines | 2015年 / 135卷 / 04期
关键词：
Nanostructures - Electroplating - Semiconductor junctions;
D O I：
10.1541/ieejsmas.135.129
中图分类号：
学科分类号：
摘要：
Delamination damages in a juncture between different materials will raise problems in electric products, such as semiconductor plastic package. In this study, we are proposing a tactic to achieve robust juncture between leadframe and epoxy resin based on nano-structure control of leadframe surface. In the result, nano-structure of plated layer on leadframe can be controlled by a strict condition of electroplating bath. The nano-structure controlled leadframe surface shown remarkable robust junction to the epoxy resin successfully. © 2015 The Institute of Electrical Engineers of Japan.
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页码：129 / 134
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