Molecular dynamics simulation of the influence factors of Cu cluster deposition on Cu surface

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College of Power Engineering, Chongqing University, Chongqing 400044, China [1 ]
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Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics | 2008年 / 29卷 / 09期
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页码：1441 / 1444
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