共 21 条
- [21] Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic hubrid functional assemblies 2ND INTERNATIONAL CONFERENCE ON SATELLITE COMMUNICATIONS - PROCEEDINGS OF ICSC '96, VOLS 1-4, 1996, : E145 - E147