共 50 条
- [21] Optimizing the stencil printing of lead free pastes using designed experiments [J]. ADVANCED ELECTRONICS ASSEMBLY - A SYMPOSIUM ON LEAD FREE INTERCONNECT TECHNOLOGY, PROCEEDINGS OF THE TECHNICAL PROGRAM, 2000, : 108 - 114
- [22] Numerical Investigation on the Effect of Squeegee Angle during Stencil Printing Process [J]. REGIONAL CONFERENCE ON MATERIALS AND ASEAN MICROSCOPY CONFERENCE 2017 (RCM & AMC 2017), 2018, 1082
- [23] STENCIL PRINTING OF SOLDER PASTE FOR FINE-PITCH SURFACE MOUNT ASSEMBLY [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (03): : 560 - 566
- [25] Optimization of stencil printing wafer bumping for fine pitch flip chip applications [J]. 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1724 - 1730
- [26] ELECTROPLATED STENCIL REINFORCED WITH ARCH STRUCTURES FOR PRINTING FINE AND LONG CONDUCTIVE PASTE [J]. 2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015), 2015, : 272 - 275
- [28] Stencil printing process modeling and control using statistical neural networks [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2008, 31 (01): : 9 - 18
- [29] NUMERICAL STUDY ON THE EFFECT OF DIFFERENT VISCOMETER TEST ON STENCIL PRINTING PROCESS [J]. JURNAL TEKNOLOGI-SCIENCES & ENGINEERING, 2022, 84 (6-2): : 135 - 143