Enhancement of Carbon Nanotube Array Interface Thermal Transport Using Nano-coating

被引:0
|
作者
Qiu, Lin [1 ,2 ]
Guo, Pu [1 ]
Feng, Yan-Hui [1 ,2 ]
Zhang, Xin-Xin [1 ,2 ]
机构
[1] School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing,100083, China
[2] Beijing Key Laboratory of Energy Saving and Emission Reduction for Metallurgical Industry, University of Science and Technology Beijing, Beijing,100083, China
来源
Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics | 2019年 / 40卷 / 09期
关键词
Heat transfer - Interfaces (materials) - Testing - Thermal conductivity - Heat resistance - Carbon nanotubes - Coatings - Plasma enhanced chemical vapor deposition - Plasma CVD - Surface roughness;
D O I
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中图分类号
学科分类号
摘要
In order to solve the heat dissipation problem of the electronic devices interface, the thermal interface material has gradually gained people’s attention and development. Carbon nanotubes Array materials have high thermal conductivity and good stability. In order to further improve the heat transfer of the array-heat sink interface, it is proposed to sputter nano-film on the top of the large-diameter carbon tube array to effectively improve the thermal resistance problem. The thermal resistance of the interface between the array and the heat sink before and after the nanofilm attachment was obtained by the 3ω method. The results show that the array covered by the coating exhibits extremely low interfacial thermal resistance, and the resistance is closely related to the surface roughness. The results provide experimental guidance for the preparation of array thermal interface materials with excellent properties. © 2019, Science Press. All right reserved.
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页码:2109 / 2114
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