A SiC double-sided stacked wire-bondless power module for high-frequency power electronic applications

This article reports a double-sided stacked wire-bondless power module package for silicon carbide (SiC) power devices to achieve low parasitic inductance and improved thermal performance for high-frequency applications. The design, simulation, fabrication, and characterization of the power module are presented. A half-bridge module based on the SiC power MOSFETs is demonstrated with minimized parasitic inductance. Double-sided cooling paths are used to maximize heat dissipation. Besides conventional packaging materials used in the power module fabrication, a low-temperature cofired ceramic (LTCC) and nickel-plated copper balls are used in this module package. The LTCC acts as an interposer providing both electrical and thermal routings. The nickel-plated copper balls replace bond wires as the electrical interconnections for the SiC power devices. The electrical and thermo-mechanical simulations of the power module are performed, and its switching performance is evaluated experimentally. © International Microelectronics Assembly and Packaging Society