Research Progress of Sn-based Lead-Free Solder

被引:0
|
作者
Pu, Cunji [1 ]
Li, Caiju [1 ]
Peng, Jubo [2 ]
Zhang, Xin [2 ]
Guo, Shaoxiong [2 ]
Yi, Jianhong [1 ]
机构
[1] Faculty of Materials Science and Technology, Kunming University of Science and Technology, Kunming,650093, China
[2] Yunnan Tin Group (Holding) Co., Ltd, Kunming,650299, China
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92
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页码:3302 / 3315
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