Direct additive copper plating on polyimide surface with silver ammonia via plasma modification

被引：0
|
作者：
Xiang, Junlun [1 ]
Zhou, Guoyun [1 ]
Hong, Yan [1 ]
He, Wei [2 ]
Wang, Shouxu [1 ]
Chen, Yuanming [2 ]
Wang, Chong [1 ]
Tang, Yao [2 ]
Sun, Yukai [2 ]
Zhu, Yongkang [3 ]
机构：
[1] School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu,610054, China
[2] Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd. & Zhuhai Founder Sci-Tech multilayer circuit board Co., Ltd, Zhuhai,519175, China
[3] Netron Soft-tech (Zhuhai) Co., Ltd, Zhuhai,519040, China
来源：
Applied Surface Science | 2022年 / 587卷
关键词：
539.3.2 Electroless Plating - 715 Electronic Equipment; General Purpose and Industrial - 803 Chemical Agents and Basic Industrial Chemicals - 804.2 Inorganic Compounds - 815.1.1 Organic Polymers - 932.3 Plasma Physics;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
32
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