Multi-Parameter Weibull Failure Model of PCB Insulation Reliability under Continuous Square Impulse Voltage

被引:0
|
作者
Zhou Q. [1 ]
Xiong T. [1 ]
Jiang T. [2 ]
Wen M. [1 ]
Ouyang X. [1 ]
机构
[1] State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing
[2] School of Electrical and Electronic Engineering, Chongqing University of Technology, Chongqing
关键词
Exponential function; Fallou model; Insulation reliability; Printed circuit board; Weibull failure distributions;
D O I
10.19595/j.cnki.1000-6753.tces.180311
中图分类号
学科分类号
摘要
Printed circuit board (PCB) is the core component of the spacecraft power supply system, and its insulation reliability directly affects the safe and stable operation of the spacecraft. For this reason, a reliability model for PCB insulation based on multi-parameter Weibull failure distributions (WFDs) is proposed. Firstly, the WFDs are used to statistically analyze the failure data of PCB under the action of electrical-thermal double stress, and the insulation characteristic failure time of PCB is obtained by the maximum likelihood estimation. Secondly, the PCB insulation reliability failure model is established through combining the exponential function (EF) and Fallou model with the standard WFDs, respectively. Finally, the behavior and mechanism of breakdown failure occurred in PCB are discussed and analyzed. The analysis shows that the occurrence and development of the electric discharge can be promoted by the temperature, electric field and the heat accumulation caused by them during PCB failure process, which accelerates the insulation degradation of PCB and reduces its insulation reliability. © 2019, Electrical Technology Press Co. Ltd. All right reserved.
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页码:1310 / 1318
页数:8
相关论文
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