共 23 条
- [1] Leone M., Radiated susceptibility on the printed circuit board level: simulation and measurement, IEEE Transactions on Electromagnetic Compatibility, 47, 3, pp. 471-478, (2005)
- [2] Tao J., Chen Y., Development of HPM weapon for foreign military, Journal of CAEIT, 6, 2, pp. 111-116, (2011)
- [3] Du B., Liu Y., Discharge performance of printed circuit board under saline fog environment, International Symposium on Electrical Insulating Materials, pp. 304-307, (2005)
- [4] Du B., Gao Y., Effect of low pressure and magnetic field on dielectric breakdown of printed circuit board, International Symposium on Discharges and Electrical Insulation in Vacuum, pp. 132-135, (2006)
- [5] Meng G., Cheng Y., Song J., Et al., Breakdown characteristics of PCB paralleled traces injected by rectangular pulse, International Conference on Electrical Insulating Materials, pp. 144-147, (2011)
- [6] Moshrefi T.M., Swingler J., Reliability of printed circuit boards containing lead-free solder in aggressive environments, Journal of Material of Science: Materials in Electronics, 22, 4, pp. 400-411, (2011)
- [7] Bo I.N., Sexmg B.J., Characteristics of environmental factor for electrochemical migration on printed circuit board, Journal of Materials Science: Materials in Electronics, 19, 10, pp. 952-956, (2008)
- [8] Zhou Y., Lan F., The effects of soluble salts in dust on insulation failure of printed circuit boards, Transactions of China Electrotechnical Society, 31, 11, pp. 114-119, (2016)
- [9] Xie C., Tang Q., Jin J., Et al., Accelerated life test and statistic alanalysis of numerical control PCB, Journal of Huazhong University of Science and Technology, 41, 12, pp. 1-6, (2013)
- [10] Xie C., Wang Y., Ying H., Reliability modeling technology for CNC PCB performance degradation based on competing failure, Journal of Hebei University of Science and Technology, 38, 2, pp. 101-107, (2017)