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- [32] Evaluation of Thermal Conductive Resistance at Organic-inorganic Interface and Development of Thermal Conductive Insulation Materials for Electric Devices 2011 ANNUAL REPORT CONFERENCE ON ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA, VOLS 1 AND 2, 2011, : 330 - 333
- [33] Metal capacitor technology for application to merged DRAM logic devices NEC RESEARCH & DEVELOPMENT, 1999, 40 (03): : 272 - 276
- [35] Advances in 4H-SiC homoepitaxy for production and development of power devices SILICON CARBIDE 2006 - MATERIALS, PROCESSING AND DEVICES, 2006, 911 : 37 - +
- [36] Study of the SiC JFET Reverse Conduction and Reverse Blocking Characteristics THIRTY-FOURTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2019), 2019, : 2751 - 2756
- [37] Suitability of 4H-SiC homoepitaxy for the production and development of power devices SILICON CARBIDE 2008 - MATERIALS, PROCESSING AND DEVICES, 2008, 1069 : 129 - 139
- [38] Development of Nickel Wire Bonding for High-Temperature Packaging of SiC Devices IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (02): : 564 - 574
- [39] Development of conductive poly (para-aminophenol)/zinc oxide nanocomposites for optoelectronic devices Polymer Bulletin, 2023, 80 : 6405 - 6432