Research Progress of Organic/Inorganic Thin Film Packaging Technology for Flexible Electronic Devices

被引：0

作者：

Feng E. ^{[1
]}

Dong M. ^{[1
]}

Han X. ^{[1
]}

Cai Y. ^{[1
]}

Feng Y. ^{[1
]}

Wang Y. ^{[1
]}

Ma M. ^{[1
]}

Wang G. ^{[1
]}

Qin L. ^{[1
]}

Ma F. ^{[1
]}

机构：

[1] Lanzhou Institute of Physics, Lanzhou

来源：

Surface Technology | 2024年 / 53卷 / 03期

关键词：

barrier mechanism; flexible electronics; interface; internal stress; organic/inorganic thin film packaging;

D O I：

10.16490/j.cnki.issn.1001-3660.2024.03.010

中图分类号：

学科分类号：

摘要：

Organic/inorganic film packaging technology is widely used in the fields of OLED, quantum dot display and organic photovoltaic. It is a new type of flexible packaging technology. The work aims to summarize the development trend of organic/inorganic film packaging technology in recent years. First of all, the development of traditional hard cover packaging methods and thin film packaging methods and its advantages and disadvantages were outlined. Secondly, the preparation methods of organic/inorganic thin films were systematically summarized, such as atomic layer deposition, plasma chemical vapor deposition, etc. Then, the principles and applications of different preparation methods were elaborated in detail. Once again, the effects of micro defects, internal stress, and material interface engineering on the packaging performance of organic/inorganic thin films were discussed. By analyzing and summarizing the technical points of preparing organic/inorganic packaging thin films, such as substrate surface pretreatment, introduction of neutral layers, and adjustment of interlayer stress, the high-quality packaging thin films were obtained. Finally, the intrinsic barrier mechanism of organic/inorganic packaging films was explored, and it was proposed that gas transport in organic/inorganic films was mainly through Nussen diffusion. Strategies to improve film packaging were summarized, including extending the gas diffusion path, actively introducing barrier groups, and modifying the film surface. This review presents the key challenges faced by future thin film packaging technology, which can provide certain reference value for the development of flexible electronic device packaging technology. © 2024 Chongqing Wujiu Periodicals Press. All rights reserved.

引用

页码：101 / 112

页数：11

共 52 条

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