Preparation of MnCo2O4 2 O 4 and Mn1.7CuFe0.3O4 1.7 CuFe 0.3 O 4 single-layer, and novel MnCo2O4/ 2 O 4 / Mn1.7CuFe0.3O4 1.7 CuFe 0.3 O 4 dual-layer spinel protective coatings on complex-shaped metallic interconnects by EPD method

Ceramic protective coatings applied to metallic interconnects play a vital role in solid oxide cells (SOCs) preventing interconnect degradation. In this study, uniform, dense, and crack-free single-layer coatings of MnCo2O4, 2 O 4 , Mn1.7CuFe0.3O4, 1.7 CuFe 0.3 O 4 , and dual-layer coatings of MnCo2O4/Mn1.7CuFe0.3O4 2 O 4 /Mn 1.7 CuFe 0.3 O 4 spinel are deposited onto complex-shaped metallic interconnect using electrophoretic deposition (EPD) method. The porosity of sintered MnCo2O4 2 O 4 and Mn1.7CuFe0.3O4 1.7 CuFe 0.3 O 4 coatings in reduction treatment (1000 degrees C for 2h in H2), 2 ), followed by subsequent oxidation treatment (900 degrees C for 2h in air) is approximately 50% less than that of these coatings sintered in oxidation treatment (900 degrees C for 4h in air). The results indicate that the thickness of the sintered MnCo2O4, 2 O 4 , Mn1.7CuFe0.3O4 1.7 CuFe 0.3 O 4 single-layer, and MnCo2O4/Mn1.7CuFe0.3O4 2 O 4 /Mn 1.7 CuFe 0.3 O 4 dual-layer coatings in reduction + oxidation treatments is 46.2%, 28.2%, and 23.1% denser, respectively, compared to sintered in oxidation treatment. Raman spectroscopy and Energy Dispersive Spectroscopy (EDS) analysis showed that in sintered dual-layer coatings subjected to reduction treatment followed by a subsequent oxidation treatment, exhibit a much more efficient interdiffusion processes throughout the thickness of the coating yielding the formation of a mixed (Mn, Cu, Fe, Co)3O4 3 O 4 spinel, comparing to dual-layer coatings undergoing only oxidation treatment. The dual-layer spinel coatings of MnCo2O4/ 2 O 4 / Mn1.7CuFe0.3O4 1.7 CuFe 0.3 O 4 present promising candidate for protective coatings on metallic interconnects.