Investigation on Artificial Intelligence Hardware Architecture Design Based on Logic-in-Memory Ferroelectric Fin Field-Effect Transistor at Sub-3nm Technology Nodes

被引:0
|
作者
Ra, Changho [1 ]
Kim, Huijun [2 ]
Park, Juhwan [1 ]
Youn, Gwanoh [3 ]
Lee, Uyong [3 ]
Heo, Junsu [3 ]
Park, Chester Sungchung [3 ]
Jeon, Jongwook [1 ]
机构
[1] Sungkyunkwan Univ, Dept Elect & Comp Engn, Suwon 16419, South Korea
[2] Sungkyunkwan Univ, Dept Semicond Convergence Engn, Suwon 16419, South Korea
[3] Konkuk Univ, Dept Elect & Elect Engn, Seoul 05029, South Korea
关键词
convolutional neural network accelerators; ferroelectrics; fin field-effect transistors; logic in memory; simulations; NM;
D O I
10.1002/aisy.202400370
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
With the advancement of artificial intelligence and internet of things, logic-in-memory (LiM) technology has garnered attention. This article presents research on LiM utilizing ferroelectric fin field-effect transistor (FinFET). Herein, the LiM characteristics of FinFET with hafnia-based switchable ferroelectric gate stack applied to the sub-3 nm future technology node are analyzed. This analysis is extended to the system level and its characteristics are observed. A compact model of the ferroelectric capacitor using Verilog-A is developed and the operation of LiM circuits such as 1-bit full adder, ternary content-addressable memory, and flip-flop by combining FinFET characteristics based on atomistic simulation with fabricated silicon-doped hafnium oxide characteristics is analyzed. Furthermore, by applying these ferroelectric devices, a power consumption reduction of 85.2% in the convolutional neural network accelerator at the system level is observed. This article examines Logic-in-Memory (LiM) technology employing Ferroelectric Fin Field-Effect Transistor for sub-3 nm nodes, focusing on system-level implications. LiM circuit performance, including full adder, ternary content-addressable memory, and flip-flop, is evaluated using a Verilog-A model of ferroelectric capacitor. Implementing these devices achieves an 85.2% reduction in power consumption for Convolutional Neural Network accelerators.image (c) 2024 WILEY-VCH GmbH
引用
收藏
页数:11
相关论文
共 24 条
  • [21] A three-dimensional simulation study of source/drain-tied double-gate fin field-effect transistor design for 16-nm half-pitch technology generation and beyond
    Eng, Yi-Chuen
    Lin, Jyi-Tsong
    Chang, Tzu-Feng
    Chen, Chun-Yu
    Fan, Yi-Hsuan
    Chen, Cheng-Hsin
    Lin, Po-Hsieh
    Japanese Journal of Applied Physics, 2011, 50 (8 PART 1)
  • [22] Performance improvements in complementary metal oxide semiconductor devices and circuits based on fin field-effect transistors using 3-nm ferroelectric Hf0.5Zr0.5O2
    Zhang, Zhao-Hao
    Luo, Yan-Na
    Xu, Gao-Bo
    Yao, Jia-Xin
    Wu, Zhen-Hua
    Zhao, Hong-Bin
    Zhang, Qing-Zhu
    Yin, Hua-Xiang
    Luo, Jun
    Wang, Wen-Wu
    Tu, Hai-Ling
    RARE METALS, 2024, 43 (07) : 3242 - 3249
  • [23] Efficient ab initio analysis of quantum confinement and band structure effects in ultra-scaled Si1-xGex gate-all-around and fin field-effect transistors for sub-10 nm technology nodes
    Liu, Jie
    Tang, Chuanxiang
    Mo, Pinghui
    Lu, Jiwu
    JOURNAL OF COMPUTATIONAL ELECTRONICS, 2018, 17 (04) : 1399 - 1409
  • [24] Efficient ab initio analysis of quantum confinement and band structure effects in ultra-scaled Si1−xGex gate-all-around and fin field-effect transistors for sub-10 nm technology nodes
    Jie Liu
    Chuanxiang Tang
    Pinghui Mo
    Jiwu Lu
    Journal of Computational Electronics, 2018, 17 : 1399 - 1409