Circuits and devices for standalone large-scale integration (LSI) chips and Internet of Things (IoT) applications: a review

被引:8
|
作者
Sugiura, Takaya [1 ]
Yamamura, Kenta [1 ]
Watanabe, Yuta [1 ]
Yamakiri, Shiun [1 ]
Nakano, Nobuhiko [1 ]
机构
[1] Keio Univ, Dept Elect & Elect Engn, Yokohama, Kanagawa 2238522, Japan
来源
CHIP | 2023年 / 2卷 / 03期
关键词
Analog LSI; Energy harvesting; Internet of Things; Sensors; PIEZORESISTIVE PRESSURE SENSOR; HIGH-EFFICIENCY; ENERGY HARVESTER; SOLAR-CELLS; CHARGE PUMP; TEMPERATURE SENSOR; CMOS; SILICON; VOLTAGE; TECHNOLOGY;
D O I
10.1016/j.chip.2023.100048
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In recent years, Internet of Things (IoT) has become more and more important owing to the rapid expansion of the number of computing devices and data sizes. The evolution of IoT requires low-power and self-operating devices to expand the coverage area of computing resources. The main components of IoT are the large-scale integration (LSI) chips, which take the function of implementing the energy harvesters, control units and applications. They exhibit different physics or phenomena, making it difficult to understand and design the entire system. The current work reviews the various methods for IoT applications by CMOS LSI chips, from the power components by energy harvesting to realistic applications with future outlooks.
引用
收藏
页数:13
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