Ultrafast laser drilling of through vias in Sodalime glass using GHz-burst mode operation

被引：0

作者：

Balage, Pierre ^{[1
]}

Lopez, John ^{[1
]}

Lafargue, Manon ^{[1
,2
]}

Guilberteau, Theo ^{[1
,3
]}

Bonamis, Guillaume ^{[2
]}

Honninger, Clemens ^{[2
]}

Manek-Honninger, Inka ^{[1
]}

机构：

[1] Univ Bordeaux, CELIA UMR5107, CNRS, CEA, F-33405 Talence, France

[2] Amplitude Cite Photon, 11 Ave Canteranne, F-33600 Pessac, France

[3] ALPhANOV, Rue Francois Mitterrand, F-33400 Talence, France

来源：

LASER PLUS PHOTONICS FOR ADVANCED MANUFACTURING | 2024年 / 13005卷

关键词：

ultrafast laser processing; GHz-bursts; femtosecond pulses; glass; through glass via (TGV);

D O I：

10.1117/12.3017014

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this contribution we show through via drillings in dielectrics by ultrafast laser top-down percussion drilling in GHz-burst mode. We point out some limitations that occur during the drilling process and show how to overcome these. Finally, we obtained through vias of almost constant diameter in Sodalime glass, which might be of interest in the microelectronics industry for the fabrication of glass interposers.

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页数：3

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