Measurement of thermal contact resistance and the design of thermal contacts at cryogenic temperatures

被引:0
|
作者
Valois, Jared [1 ]
Nellis, Gregory [1 ]
Pfotenhauer, John [1 ]
机构
[1] Univ Wisconsin, Dept Mech Engn, Madison, WI 53706 USA
关键词
Thermal bulk conductivity; Thermal contact resistance; Mechanical contacts; Gold plated; Oxygen Free High Conductivity Copper (OFHC); JOINTS;
D O I
10.1016/j.cryogenics.2024.103922
中图分类号
O414.1 [热力学];
学科分类号
摘要
The prevalence of technologies that operate at cryogenic temperatures requires that the cooling systems used to maintain these systems be carefully designed. This research focuses on understanding the thermal performance of the heat path between the heat source (the technology being cooled) and the cooling source (the cryocooler). Specifically, this work characterizes through measurement the thermal properties of common heat path materials, with a focus on bulk thermal conductivity and thermal contact resistance of pressed contacts. A framework for using these measurements to optimize a bolted contact is proposed and demonstrated.
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页数:14
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