Leakage current in GaN-on-GaN vertical GaN SBDs grown by HVPE on native GaN substrates

被引:0
|
作者
Jin, Weiyi [1 ,2 ]
Zhang, Yumin [2 ,3 ]
Xia, Songyuan [2 ]
Zhu, Qizhi [1 ,2 ]
Sun, Yuanhang [1 ,2 ]
Yi, Juemin [2 ]
Wang, Jianfeng [2 ,3 ]
Xu, Ke [2 ,3 ,4 ]
机构
[1] Univ Sci & Technol China, Sch Nanotech & Nanob, Hefei 230026, Anhui, Peoples R China
[2] Chinese Acad Sci, Suzhou Inst Nanotech & Nanob, Suzhou 215123, Jiangsu, Peoples R China
[3] Suzhou Nanowin Sci & Technol Co Ltd, Suzhou 215123, Jiangsu, Peoples R China
[4] Jiangsu Inst Adv Semicond, Shenyang Natl Lab Mat Sci, Suzhou 215123, Jiangsu, Peoples R China
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
SCHOTTKY-BARRIER DIODE; CONDUCTION;
D O I
10.1063/5.0208706
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This study investigates leakage mechanisms in vertical GaN-on-GaN Schottky barrier diodes (SBDs) and demonstrates effective mitigation strategies. The fabricated devices exhibit low reverse leakage current (1 x 10(-5) A/cm(2) at -200 V) and a high I-on/I-off ratio (similar to 10(10)), surpassing the performance of GaN SBDs on foreign substrates. We elucidate dominant leakage mechanisms-thermionic emission, Poole-Frenkel emission, and variable-range hopping-and their evolution with temperature and bias. Optimized fabrication processes, including defect etching and a novel dual-layer passivation technique, achieve over a 1000-fold reduction in leakage current.
引用
收藏
页数:9
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