Three-Dimensionally Printed Ternary Composites of Polyamide: Effect of Gradient Structure on Dimensional Stability and Mechanical Properties

Fused deposition modeling (FDM) 3D printing has the advantages of a simple molding principle, convenient operation, and low cost, making it suitable for the production and fabrication of complex structural parts. Moving forward to mass production using 3D printing, the major hurdle to overcome is the achievement of high dimensional stability and adequate mechanical properties. In particular, engineering plastics require precise dimensional accuracy. In this study, we overcame the issues of FDM 3D printing in terms of ternary material compounds for polyamides with gradient structures. Using multi-walled carbon nanotubes (MWCNTs) and boron nitride (BN) as fillers, polyamide 6 (PA6)-based 3D-printed parts with high dimensional stability were prepared using a single-nozzle, two-component composite fused deposition modeling (FDM) 3D printing technology to construct a gradient structure. The ternary composites were characterized via DSC and XRD to determine the optimal crystallinity. The warpage and shrinkage of the printed samples were measured to ensure the dimensional properties. The mechanical properties were analyzed to determine the influence of the gradient structures on the composites. The experimental results show that the warpage of pure polymer 3D-printed parts is as high as 72.64%, and the introduction of a gradient structure can reduce the warpage to 3.40% by offsetting the shrinkage internal stress between layers. In addition, the tensile strength of the gradient material reaches up to 42.91 MPa, and the increasing filler content improves the interlayer bonding of the composites, with the bending strength reaching up to 60.91 MPa and the interlayer shear strength reaching up to 10.23 MPa. Therefore, gradient structure design can be used to produce PA6 3D-printed composites with high dimensional stability without sacrificing the mechanical properties of PA6 composites.