Heat Transfer Model Based on Flow Pattern during Flow Boiling in Rectangular Microchannels

被引:0
|
作者
Zhu, Jiamin [1 ]
Zhang, Peng [2 ]
Tan, Sicong [1 ]
Wang, Tao [3 ]
Guo, Chaohong [2 ]
Jiang, Yuyan [1 ]
机构
[1] Beijing Inst Technol, Sch Mech Engn, Beijing 100081, Peoples R China
[2] Chinese Acad Sci, Inst Engn Thermophys, Beijing 100190, Peoples R China
[3] Beijing Univ Chem Technol, Coll Mech & Elect Engn, Beijing 100029, Peoples R China
基金
中国国家自然科学基金;
关键词
heat transfer; non-circular microchannels; flow boiling; thermal management; PRESSURE-DROP; FUNDAMENTAL ISSUES; FILM THICKNESS; MICROSCALE; BUBBLE; EVAPORATION; CHANNEL; MECHANISMS; FLUID; WALL;
D O I
10.3390/aerospace11090733
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
In thermal management applications using two-phase flow boiling, rectangular microchannels hold significant promise due to their ease of manufacturing and effective heat transfer characteristics. In this work, we combined experimental and theoretical analyses to propose a theoretical model based on thin liquid film evaporation for predicting heat transfer performance in rectangular cross-sectional microchannels. The heat transfer model is segmented into five zones based on two-phase flow patterns and transient liquid film thickness. These zones represent different flow boiling heat transfer mechanisms over time in microchannels: the liquid slug zone, elongated bubble zone, long-side wall dryout zone, corner liquid evaporation zone, and full dryout zone. The new model comprehensively explains experimental phenomena observed, including long-side wall dryout and thinning of the liquid film on the short-side wall. To validate our model, numerical solutions were computed to study the spatial and temporal variations in heat transfer coefficients. The results exhibited a consistent trend with experimental data regarding average heat transfer coefficients. We also analyzed factors influencing flow boiling characteristics, such as microchannel aspect ratio, hydraulic diameter, measurement location, fluid mass flux, and wall heat flux.
引用
收藏
页数:27
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