Wafer-scale synthesis of twodimensional materials for integrated electronics

被引:1
|
作者
Liu, Zijia [1 ,2 ]
Gong, Xunguo [1 ,2 ]
Cheng, Jinran [1 ,2 ]
Shao, Lei [3 ]
Wang, Chunshui [4 ]
Jiang, Jian [1 ,2 ]
Cheng, Ruiqing [1 ,2 ,3 ]
He, Jun [1 ,2 ]
机构
[1] Wuhan Univ, Key Lab Artificial Micro & Nanostruct, Sch Phys & Technol, Wuhan 430072, Hubei, Peoples R China
[2] Wuhan Univ, Sch Phys & Technol, Wuhan 430072, Peoples R China
[3] Wuhan Guide Infrared Co Ltd, Wuhan 430200, Peoples R China
[4] Global Sensor Technol, Wuhan 430200, Peoples R China
来源
CHIP | 2024年 / 3卷 / 01期
基金
中国国家自然科学基金;
关键词
2D materials; Wafer-scale synthesis; 2D integrated devices; Post-moore electronics; ATOMIC-LAYER-DEPOSITION; SINGLE-CRYSTAL; BORON-NITRIDE; LARGE-AREA; EPITAXIAL-GROWTH; MOS2; TRANSISTORS; 2D MATERIALS; GRAPHENE; MONOLAYER; FILMS;
D O I
10.1016/j.chip.2023.100080
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Two-dimensional (2D) van der Waals materials have attracted great interest and facilitated the development of post-Moore electronics owing to their novel physical properties and high compatibility with traditional microfabrication techniques. Their wafer-scale synthesis has become a critical challenge for large-scale integrated applications. Although the wafer-scale synthesis approaches for some 2D materials have been extensively explored, the preparation of high-quality thin films with well-controlled thickness remains a big challenge. This review focuses on the wafer-scale synthesis of 2D materials and their applications in integrated electronics. Firstly, several representative 2D layered materials including their crystal structures and unique electronic properties were introduced. Then, the current synthesis strategies of 2D layered materials at the wafer scale, which are divided into "top-down" and "bottom-up", were reviewed in depth. Afterwards, the applications of 2D materials wafer in integrated electrical and optoelectronic devices were discussed. Finally, the current challenges and future prospects for 2D integrated electronics were presented. It is hoped that this review will provide comprehensive and insightful guidance for the development of wafer-scale 2D materials and their integrated applications.
引用
收藏
页数:20
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