Impedancemetry of multiplexed quantum devices using an on-chip cryogenic complementary metal-oxide-semiconductor active inductor

被引:1
|
作者
Le Guevel, L. [1 ,2 ,3 ]
Billiot, G. [1 ]
De Franceschi, S. [2 ]
Morel, A. [1 ,4 ]
Jehl, X. [2 ]
Jansen, A. G. M. [2 ]
Pillonnet, G. [1 ]
机构
[1] Univ Grenoble Alpes, CEA, LETI, F-38000 Grenoble, France
[2] Univ Grenoble Alpes, CEA, Grenoble INP, IRIG,PHELIQS, F-38000 Grenoble, France
[3] Univ Massachusetts Amherst, Dept Elect & Comp Engn, Amherst, MA 01003 USA
[4] Univ Savoie Mont Blanc, SYMME, F-74000 Annecy, France
来源
CHIP | 2023年 / 2卷 / 04期
基金
欧盟地平线“2020”;
关键词
Impedancemetry; Qubit readout; Cryogenic circuit; Active inductor; CMOS; PROCESSOR;
D O I
10.1016/j.chip.2023.100068
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the pursuit for scalable quantum processors, signi fi cant effort has been devoted to the development of cryogenic classical hardware for the control and readout of a growing number of qubits. The current work presented a novel approach called impedancemetry that is suitable for measuring the quantum capacitance of semiconductor qubits connected to a resonant LC-circuit. The impedancemetry circuit exploits the integration of a complementary metal-oxide-semiconductor (CMOS) active inductor in the resonator with tunable resonance frequency and quality factor, enabling the optimization of readout sensitivity for quantum devices. The realized cryogenic circuit allows fast impedance detection with a measured capacitance resolution down to 10 aF and an input-referred p ffiffiffiffiffiffi noise of 3.7 aF/ Hz. At 4.2 K, the power consumption of the active inductor amounts to 120 mu W, with an additional dissipation for on-chip current excitation (0.15 mu W) and voltage ampli fi cation (2.9 mW) of the impedance measurement. Compared to the commonly used schemes based on dispersive RF re fl ectometry which require millimeter-scale passive inductors, the circuit exhibits a notably reduced footprint (50 mu m 3 60 mu m), facilitating its integration in a scalable quantumclassical architecture. The impedancemetry method has been applied at 4.2 K to the detection of quantum effects in the gate capacitance of on-chip nanometric CMOS transistors that are individually addressed via multiplexing.
引用
收藏
页数:9
相关论文
共 50 条
  • [21] C-band complementary metal-oxide-semiconductor bandpass filter using active capacitance circuit
    Wang, Sen
    Lin, Wen-Jie
    IET MICROWAVES ANTENNAS & PROPAGATION, 2014, 8 (15) : 1416 - 1422
  • [22] Defect state passivation at III-V oxide interfaces for complementary metal-oxide-semiconductor devices
    Robertson, J.
    Guo, Y.
    Lin, L.
    JOURNAL OF APPLIED PHYSICS, 2015, 117 (11)
  • [23] Optical propagation and refraction in silicon complementary metal-oxide-semiconductor structures at 750 nm: toward on-chip optical links and microphotonic systems
    Ogudo, Kingsley A.
    Schmieder, Diethelm
    Foty, Daniel
    Snyman, Lukas W.
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2013, 12 (01):
  • [24] Above-Complementary Metal-Oxide-Semiconductor Inductor for Rapid Prototyping of Mixed-Signal System on Chips
    Omiya, Yutaka
    Kotani, Koji
    Ito, Takashi
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2010, 49 (04)
  • [25] Matched printed carbon nanotube complementary metal-oxide-semiconductor (CMOS) devices for flexible circuits
    Guo, Penghui
    Li, Min
    Shao, Shuangshuang
    Fang, Yuxiao
    Chen, Zheng
    Guo, Hongxuan
    Zhao, Jianwen
    CARBON, 2023, 215
  • [26] Probing nanoscale local lattice strains in advanced Si complementary metal-oxide-semiconductor devices
    Huang, J.
    Kim, M. J.
    Chidambaram, P. R.
    Irwin, R. B.
    Jones, P. J.
    Weijtmans, J. W.
    Koontz, E. M.
    Wang, Y. G.
    Tang, S.
    Wise, R.
    APPLIED PHYSICS LETTERS, 2006, 89 (06)
  • [27] Design of On-Chip High Speed Interconnect on Complementary Metal Oxide Semiconductor 180 nm Technology
    Oshita, Takao
    Amakawa, Shuhei
    Ishihara, Noboru
    Masu, Kazuya
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2010, 49 (04)
  • [28] Fabrication Technology of Microelectromechanical Systems Probe Chip Compatible with Standard Complementary Metal-Oxide-Semiconductor Process
    Huang, Jung-Tang
    Lee, Kuo-Yu
    Hsu, Hou-Jun
    Wu, Rung-Gen
    Lin, Ming-Zhe
    Tsai, Ting-Chiang
    Chen, Ching-Kong
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2010, 49 (06) : 06GN021 - 06GN024
  • [29] Active silicon microring resonators using metal-oxide-semiconductor capacitors
    Li, C
    Poon, AW
    2004 IST IEEE INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS, 2004, : 19 - 21
  • [30] A complementary metal-oxide-semiconductor vision chip for edge and motion detection with a function for output offset cancellation
    Park, JH
    Kim, JH
    Suh, SH
    Shin, JK
    Lee, M
    Choi, P
    Yagi, T
    OPTICAL REVIEW, 2005, 12 (01) : 15 - 19