Highly Functional Materials for Advanced Package

Recently, in addition to enhancing the performance of semiconductor integrated circuits by process node evolution, advanced packaging technology is also driving the progress of electronic devices. In advanced packaging technology, chiplets integration technology is being paid much attention based on the functional and economical requirements, whereas there are some challenges to be solved. Regarding reliability, thermal management should be in consideration because power density is being increased in electronic devices. As for manufacturing, assemble process become so complicated that the material to enable the simplified process is preferred. Furthermore, in order to achieve higher performance beyond the limitation of electric signal transmission, CPO (Co-Packaged Optics) is expected to be a promising technology. In this technology, formation of well-controlled interface between electrical and optical signal is quite important. In this paper, we would like to introduce our proposal of new functional materials for advanced package including thermal interface sheet with vertically oriented graphite fillers, chemical resistant dicing tape, high heat resistant temporary bonding film, and optical transparent adhesive.